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By S. Seetharaman

A mathematical model has been developed to evaluate the viscosities of melts at high temperatures. The viscous flow in liquid is described by the equation, {n = Aexp(AG*/RT)} based on the absolute reaction rate theory. The Gibbs energy of activation,{ AG* } is considered to be a function of the temperature as well as the composition of the melt. The model has been applied successfully to various metallic and slag systems from unary to quaternary. On the basis of this model, a relationship has been suggested to relate the Gibbs activation energy of viscosity to the Gibbs energy of mixing in binary metallic melts. The viscosities predicted from available thermodynamic data in the case of a number of binary metallic systems using this correlation show satisfactory agreement with the reported experimental values.

Jan 1, 1994

By Alicia E. Ares

316 L Stainless Steel samples were solidified directionally under conditions which produced the columnar to equiaxed transition. The position of the transition was located in each sample and the distance from the bottom of the ingot was measured. During solidification the distribution of temperatures were measured by means of thermocouples located strategically. From the measured temperatures the following parameters were derived; the local temperature gradient, the cooling rate and the velocities of the liquid and solidus fronts. Comparing the location of the transition and the values of these parameters it was found that the temperature gradient reaches negative values of as low as -13.44 "C/cm, and velocities of the fronts of around 0.1 cm/s. Also, a supercooling of 5.81°C were measured which was associated with the supercooling for the nucleation and growth of the equiaxed grains ahead of the columnar front. In addition the primary and secondary dendritic spacing was measured in both regions. The spacing was compared with the predictions from available models. The results are presented and discussed in the frame of the results obtained for other alloys

Jan 1, 2002

By F. F. Aplan, G. Simkovich

"A review is given of the effects of solid state point imperfections upon a number of mineral benefication processes and a metal extraction process. It has been found in numerous flotation studies that small amounts of aliovalent impurities (dopants) in binary compounds may show major effects upon flotation behavior. Both semiconducting and ionic conducting compounds are affected. These effects are also seen in hydrometallurgical studies as well as in electrostatic operations. Additionally, de-copperization of lead melts appears to be strongly influenced by similar defects. It is hypothesized that the effects observed in these studies are present in actual operations and should be considered in designing processes. A few speculations concerning future efforts are advanced. IntroductionImperfections [point (e.g., vacancies, interstials, quasi-free electrons, electron holes, impurity ions), line (e.g., dislocations), two dimensional (e.g., grain boundaries) and three dimensional (e.g., 2nd phases) defects] are generally present in solid materials and these imperfections may, and often do, have important effects upon a variety of properties and processes. In general, one may, in most cases, attain elimination of three dimensional defects by a separation process of one type or another (e.g., gravity, electrostatic, magnetic, flotation, hydrometallurgical etc.,). Thus, this type of defect has rarely been investigated in a systematic fashion. Two dimensional defects are always present in non-single crystal materials but have also escaped systematic studies in processes primarily because the control of such defects is not easily attained. Line defects are non-equilibrium entities which are present in ill-defined quantities so that they present a variable that cannot be easily controlled although through careful systematic experiments one can attain some reproducible relations pertaining to this type of defect.Contrary to the lack of studies concerned with the effects of 1, 2 and 3 dimensional types of defects there has been some activity concerned with point defects and their effects upon a number of mineral/metallurgical processes, especially flotation processes. Thus, this article will present a review primarily of point defects in relation to their effects upon flotation although other processes and defects will also be mentioned."

Jan 1, 1988

By Mingchun Lu, Yunjin Yan

"This paper describes a new type of bell-less top installed on two relined blast furnaces at Tianjin Iron Works and another new-built at Echeng Steel Works in China. A compact installation was presented for existing furnace top innovation with the least reformation of existing top structure. A water cooling and sealing gearbox used for driving the chute discards completely the traditional idea about necessity of continuous supply of cooling gas for the gearbox. A multiring spreader and its dozens of selectable charging patterns enables an operator to achieve optimal burden distribution easily under the condition of a minimum investment of control equipment. Some useful conclusions have been made through a small-size model and a full-scale model tests. The excellent characteristics and the superiority of the new top have been fully proved at both works.IntroductionIt is known that there are some advantages with the bell-less top of a blast furnace: suitable for furnace to operate at high top pressure, capable of realizing optimal burden distribution, less investment and maintenance costs, etc. But why do most of blast furnaces in the world still remain using conventional bell top. One of the concerns is that current bell-less tops still have some shortcomings:1) The height of a current bell-less top might be lower than three or four-bell top or two-bell plus valve seal top, but still much higher than an ordinary two-bell top.2) The gearbox for driving the rotating chute is positioned onto the lip of the furnace. It is subject to attack by crude hot bf gas. Continuously pumping cooling gas (pressurized nitrogen or clean bf gas) into the gearbox is indispensable to withstand such a harsh working environment. Therefore, a plant furnished with blower8 and its ancillaries has to be built, It involves a large sum of investment and much expense in its annual running costs.3) Although the current bell-less charging device as a means of controlling burden distribution possesses a wide range of freedom, it is difficult to realize optimal burden distribution. There are some large blast furnaces realized better burden distribution, but sophisticated control means is indispensable so that the investment of control means is much higher."

Jan 1, 2000

By D. F. Suarez

Spontaneous nodulation leading to growth of well developed glossy spheroids (generally hemispheres) of up to 0.06 cm width in 120 min has been observed during copper electrodeposition with certain levels of glue, thiourea and C1-. Thiourea alone can produce spontaneous nodulation but addition of glue and/or Cl- is required for rapid and sustained growth. In most cases once the glossy nodules develop they consume the majority of the copper deposited; thus, the specific current densities (and hence copper electrodeposition rates) on the glossy nodules are about an order of magnitude or, more greater than on the adjacent planar surfaces. The texture of the adjaoent planar surfaces is not glossy in appearance but is well faceted showing the usual deposition grain structure for such additives. Cathode potentials when spontaneous nodulation occurs are about TOO my more negative than with usual copper electroplating. This fact associated with evidence of extremely high levels of cathode surface passivation based on cyclic voltammograms indicates that the conditions which lead to spontaneous nodulation result from a very tightly adsorbed additive surface film. This film breaks down in specific points initiating the glossy nodules which then grow at extremely rapid rates. Current density is also important in spontaneous nodulation. At equal deposition times a current density of 21.5 mA/cm produced much larger glossy nodules than at 48 mA/cm2. The surface concentration of the glossy nodules was much greater in the latter case, however. The role of current density is still not well understood. The role of it as well as the relative roles of the three additives, thiourea, glue and Cl- in spontaneous nodulation is presented. Preliminary results and some possible correlations of these to help explain spontaneous nodulation are presented. It is believed that tankhouse upsets where cathode nodulation occurs may be related to this phenomenon.

Jan 1, 1987

By David G. Dixon

Although the kinetics of leaching processes are of paramount importance in the design and analysis of nearly all hydrometallurgical flowsheets, these concepts remain poorly understood and, as a result, are only rarely applied to mass and heat balance models. In this second of two papers, we demonstrate how simple yet powerful models of leaching kinetics and other rate processes may be added to mass and heat balance models, and apply these concepts using a spreadsheet model of a simplified pyrite autoclaving flowsheet. In particular, we focus on the interpretation and scale-up of batch leaching data, and on simple means for modeling other phenomena commonly associated with leaching, such as reagent depletion, gas-liquid mixing, and the precipitation of oxides and basic salts.

Jan 1, 2002

By Muammer Kaya

This paper reviews the existing and state of art knowledge for electronic waste (e-waste) recycling. Electrical/electronic equipments (EEEs) which are unwanted, broken or discarded by their original users are known as e-waste. The main purpose of this study is to provide a review of e-waste problem, give e-waste management strategies and introduce various physical e-waste recycling processes with special attention towards extraction of both metallic values and nonmetallic substances. The hazards arise from the presence of heavy metals (e.g. Hg, Cd, Pb etc.), brominated flame retardants (BFRs) and other potentially harmful substances in e-waste. Due to the presence of these substances, e-waste is generally considered as hazardous waste and may pose significant human and environmental health risks if improperly managed. This review paper describes the potential hazards and economic opportunities of e-waste. First of all, an overview of e-waste/printed circuit board (PCB) components and substances are given. Current status and future perspectives of e-waste and waste PCB recycling techniques are described. E-waste characterization, dismantling, liberation, classification and separation processes, are also covered. Manual selective dismantling after desoldering and metal-nonmetal liberation at −150 μm with two step crushing are seen to be the best techniques. After size reduction, mainly physical separation processes employing gravity, electrostatic, magnetic separators etc., which are commonly used in mineral processing, have been critically reviewed here for separation of metals and nonmetals. The recovery of pure metals from e-waste after physical separation can be performed by pyrometallurgical, hydrometallurgical or biohydro metallurgical routes, which are not covered here. Suitable PCB recycling flowsheets for industrial applications are also given. E-waste recycling will be a very important sector in the near future from economic and environmental perspectives for both developing and developed countries. Recycling technology aims to take today’s waste and turn it into conflict-free, sustainable polymetallic secondary resources (i.e. Urban Mining) for tomorrow. Recycling technology must ensure that e-waste is processed in an environmentally friendly manner, with high metal/nonmetal recovery efficiency a lowered carbon footprint. Taking into consideration our depleting natural resources, this Urban Mining approach offers quite a few benefits; it provides a substantial secondary resource, while also ensuring that the environment is kept free from harmful toxins in e-waste. This results in increased energy efficiency and lowers demand for mining of new raw materials.

Mar 1, 2017

By Du Sichen, S. Seetharaman, A. Jakobsson

"In the Present paper, the principles of oxygen potential measurements have been discussed along with the design details for oxygen sensors that are used in copper industry. A description of some of commercial probes is presented along with their salient features. The application of these sensors in flash smelting, converter and casting sections of copper production are discussed along with their implications on process optimization.I. IntroductionThe high temperature galvanic cells have come into prominence on account of their numerous applications in both fundamental as well as applied measurements. Since the inception of the oxygen-ion conducting electrolytes like ZrOrCaO·by Kiukkola and Wagner [1], the oxygen concentration cells have been extensively used in laboratories as well as in industries. In metal-production technology, these cells have been used to monitor the oxygen potentials in metallic, slag as well as gas phases and also to control and styr metallurgical processes. The pioneer among the various industrial users of such cells is the copper industry. To-day, high temperature solid electrolyte cells involving oxygen ion conducting electrolytes have become an integral part of copper pyro-refining and continuous casting. In the present paper some of the applications according to the industrial processes are described including the developments that are going on in the European scene."

Jan 1, 1997

By S. I. Sobol

Completeness of cobalt recovery from slag requires decomposition of maggemite and non - ferrous metal desorption with polymerized silicon-acid. Cobalt losses are reduced in leaching tai1s up to 200 g/t of iron.

Jan 1, 1993

By C. Kathryn Sole

The close proximity of cobalt and nickel on the Periodic Table and their frequent occurrence together in nature means that their separation in primary hydrometallurgical flowsheets is not only often necessary, but requires the use of innovative chemistry to achieve high selectivity. Today, increasingly stringent demands for the high-purity cobalt and nickel salts required for battery applications in consumer electronics, electric vehicles, and solar applications are again challenging the state of the art. The evolution of cobalt–nickel separations is traced from the basic precipitation technologies employed in 1960s, through commissioning of the first cobalt solvent-extraction plant in South Africa in 1974, to the commercialisation of organophosphinic-acid extractants (which provided a step-change improvement in selectivity) and their eventual widespread use in the 1980s and ’90s. This was followed later by their sulphur analogue, which enabled different possibilities for laterite processing in the new millennium. Separations in chloride media, which take advantage of the different speciation chemistries, and nickel extraction by oximes in ammoniacal systems are also discussed. More recently, chelating and solvent-impregnated resins have added further dimensions to the possibilities for flowsheet design and enabled higher purity products to be attained from both primary and secondary sources. Selected case studies and flowsheets are described.

By Jorge Alberto Soares Tenório, Viviane Tavares de Moraes, Denise Crocce Romano Espinosa, Franco Alves Lavacchini Ramunno

"The traditional process for recovery of metals from waste electric and electronic equipment (WEEE) usually involves pyrometallurgical processing. However, the application of this technology to processing waste printed circuit boards (WPCBs) might lead to the formation of dioxins and furans, due to thermal degradation of flame-retardants and polymeric resins present in the board substrate. Therefore, this paper proposes a hydrometallurgical route for the recovery of copper. The acid leaching behavior of copper has been investigated at three different temperatures (25°C, 50°C and 75°C) with and without the addition of an oxidizing agent (hydrogen peroxide - H202). The dissolution kinetics for acid copper leaching was calculated based on chemical analysis by ICP-OES (Inductively Coupled Plasma - Optical Emission Spectroscopy). At 50°C with 1 mol/L H2S04 added 10 mL H202 (30%) each half hour under pulp density of 1 g I 10 mL, 100% of copper was extracted after 3 hours. The dissolution kinetics of copper with H2SO4-H2O 2 followed 1 - (1 - X)113 =Ket, i.e. chemically controlled reaction model.IntroductionThe information regarding the generation of waste electric and electronic equipment (WEEE) are still difficult to obtain because the estimates should take into consideration the historical production and sale of various products and the rate at which they reach the end of their life cycle, whose duration depends on the behavior of consumers [1]. Thus, the estimated overall WEEE generation varies between 25 and 50 million tons each year, which corresponds to more than 5% of all municipal waste generated [2], and this amount will increase at a rate of 3 to 5% per year, approximately three times faster than other individual types of waste [3].Printed circuit boards (PCBs) are essential parts of electric and electronic equipment (EEE), being found in virtually all electronic products, as well as in weapons systems [4]. A PCB is a basic component, which consists of a board where copper tracks are deposited. While the board behaves as an electrical insulator, the tracks connect electrically the various components attached to the board [ 5]. In addition to glass fibers, paper and resins, the PCBs contain significant amounts of metals, such as copper, iron, nickel, lead, stain, silver, gold and palladium [6]. In general, the weight fraction of metal is around 28% and the remainder of the boards is composed of plastic (19%), bromine (as flame retardant - 4%) and ceramic material (49%) [7]."

Jan 1, 2014

By N. A. Barcza

DC plasma-arc technology using a hollow graphite electrode (cathode) has been successfully implemented in the primary metallurgical industry in South Africa up to the 30 MW scale. Mintek has applied its expertise base, established over the past fifteen years, to testing the treatment of metallurgical wastes such as carbon- and stainless-steel plant dusts, lead- and zinc-containing slags, and residues from the base-metal industry. Favourable results have been achieved, and disposable products were produced. The evaluation of numerous wastes indicates that recovery of zinc as metal gives the best economic return from these sources. Direct recovery via a splash condenser or electrolytic zinc extraction from fume are the two preferred alternatives under review. In both instances dehalogenation is an important issue, but can be achieved by suitable treatment processes. The Enviroplas technology provides a flexible, commercially viable approach to the treatment of a wide variety of wastes. Mintek, together with its associate Pyromet CC, are installing a plasma- arc pilot-plant facility with both an ISP lead-splash condenser of about 5 t/d condensed zinc capacity and a combustion chamber to burn zinc vapour to zinc oxide. This will demonstrate the suitability of the Enviroplas technology for treating specific metallurgical wastes, so that customized industrial plants can be engineered based on large-scale testwork.

Jan 1, 1994

By J. H. Meza V

La Caridad operated at only 65% of design capacity during the first five years of operation. After the first major shutdown and repairs to the furnace in mid- 1992, the smelter quickly reached 95% of design capacity. Converter operation is now more efficient; blowing times have decreased from about 1.7 to 1.2 min/ton of matte. Anode copper production is now 15000 tons/month. The increased efficiency provided by better coordination and scheduling ensures La Caridad's ability to operate at present and expanded production capacity while simultaneously meeting environmental control standards.

Jan 1, 1993

By D. L. Jones

The leaching of natural chalcopyrite was studied in both ferric sulfate and ferric chloride solutions. The chemistry of the two reactions is quite different, with substantial sulfur oxidation occurring only in sulfate solutions. Ferric chloride is a more effective reagent, for the leaching rate is greatly increased with finer particles and higher (Fe+++), and unaffected by high (Fe++); none of these advantages are found with ferric sulfate. In addition, the morphology of leaching appears to be different, with ferric sulfate leaching preferentially along fissures or grain boundaries. The kinetics were found to be linear over an extended period, rather than parabolic as reported elsewhere. An explanation of the observed phenanena is proposed using the electrochemical theory of leaching, and experimental measurement of the mixed potential of the mineral during leaching.

Jan 1, 1976

By Roger C. Urquhart

Copper-nickel-sulphide ores mined in the Rustenburg district of South Africa are generally smelted in electric furnaces because of the high-temperature slag produced, the availability of cheap electric power, and the smaller pollution problems. Apart from melting, the functions of the electric furnace are to recover most of the matte content in the converter slag by physical and chemical interaction with the furnace bath and to provide adequate time for the optimum separation of matte and slag. Smooth, efficient operation will denend on fluid slags for settling, balanced by high resistivities to obtain adequate concentration and distribution of power by way of current heating. To obtain a greater understanding of the processes involved, an investigation was undertaken at Rustenburg Platinum Mines on the smelting of copper-nickel concentrates in a 19.5 MVA furnace with six in-line electrodes. The matte- and slag-tapping temperatures, slag temperatures, slag analyses, electrical data, and electrode position were measured. Radioactive tracers were introduced into the slag, and quantitative results relating to the flow pattern within the furnace were obtained. These studies were augmented by scaled laboratory investigations relating to the determination of cell constants and current distribution within the furnace. Instantaneous field and power distribution plots were determined by use of an on-line mini-computer. The applicability of these results to furnace operation is discussed.

Jan 1, 1976

By Rainer Schmid-Fetzer

"Isothermal solidification can be used to form strong bonds at low temperature which remain solid at much higher temperatures. The exploitation of this principally known technique for new high temperature processing steps and applications in electronic assemblies is the aim of this study. Three basically different variants of this bonding process are given. A comprehensive metallurgical screening is performed and the feasibility of binary material systems is given on a quantitative scale. Very attractive systems are spotted that have never been studied before. Detailed examples for the realization of bonding with complex ternary and multilayer systems are given. A highly innovative example is the chip stack or wafer to wafer bonding of unmetallized Si or SiC at 250°C. The proposed bond remains stable above the melting point of Si and enables entirely new semiconductor manufacturing steps. An improved die bonding process was proposed and verified experimentally.1. IntroductionIsothermal solidification can be applied to form strong bonds at relatively low temperature which remain solid at higher temperatures. The general principle of this type of joining processes is illustrated in Fig. 1. An interlayer of a low melting component, Lo, is provided as a foil or a thin film coating between the high melting joint components, Hi. The assembly is heated under moderate pressure to the bonding temperature, T 8 , and a liquid filler forms, either because the melting point of Lo is exceeded or due to a eutectic reaction between Lo and Hi. This molten filler initiates a rapid interdiffusion or reaction diffusion between Lo and Hi and the subsequent approach to an equilibrium state results in isothermal solidification. The solid phases formed at T 8 in the joint region exhibit a remelt temperature above T8 •"

Jan 1, 1996

By K. C. Mills, P. N. Quested, A. P. Day, R. F. Brooks

"Methods have been developed to measure the physical properties of molten materials relevant to the fluid flow in high temperature processes. Data for the densities, viscosities and surface tensions of Al-, Ni- and Fe-based alloys are compared with (i) values for the pure metals and (ii) estimated values obtained from models making use of chemical composition of the alloy. Experimental values for metallurgical slags are also given and compared with estimated values.1 IntroductionPhysical property data has proved very useful in improving process control and product quality. For instance, in the continuous casting of steel the viscosity (TJ) of the mould flux is important since it determines (i) the optimum casting conditions, nVc = 2.5±1 dPas (m min-1) where V c is the casting speed and (ii) the level of slag entrapment (which leads to inclusions) in the metal. Thus data for properties like viscosity are exceedingly useful in understanding the process and the problems encountered and the causes of defects and problems.Another interesting development which has helped to increase our knowledge of processes and improve process control and product quality is the development of mathematical models of the fluid and heat flow in the process. These models have been developed to the stage where one of the prime requirements is for good physical property data for the industrial materials involved. Recently, Oxley [1] has shown that the use of reliable, experimental, property values for the commercial alloy in a commercial software package produced a significant improvement in the prediction of casting defects. Thus reliable property data are required for liquid metals but also for (i) liquid slags since many processes involve the use of a slag to refine and protect the metal or to lubricate the mould and (ii) refractories, sand and investment moulds."

Jan 1, 1999

By John L. H. Patterson

Handheld XRF has become the favorite way of measuring the content and identity of alloys in the field. This is because of the very portable nature of the instrumentation and its simple operation. However, these analyzers have been unable to determine the concentration of the light elements like Mg and Si due to the very low energy of the x-rays produced by these elements. In the past accessories such as vacuum and He flush have given some analyzers the ability to determine these light elements with modest detection limits. The introduction of the Silicon Drift Detector (SDD) into this class of instrumentation has added a new level of analysis capability to portable XRF instrumentation. X-ray fluorescence is achieved by exciting a sample with a beam of x-rays, which in recent portable equipment are generated by a small tube. This results in the emission of characteristic x-rays from the sample under test. By measuring the energy of each x-ray it is possible to determine what element generated it. By counting the number of x-rays at each energy it is possible to determine the concentration of each element. The detection limit for each element is dependent upon the number of x-rays which reach the detector. As the number of x-rays increases the detection limit will improve. One of the major factors in an x-ray reaching the detector is the energy of the x-ray. As the energy of an x-ray increases the probability of that x-ray reaching the detector increases. The energy of an x-ray is inversely proportional to the atomic number (AN) of the element generating the x-ray. For example, an iron x-ray (AN=26) is 6.40 keV while an aluminum x-ray (AN=13) is 1.49 keV. As the energy decreases, the detection of the x-ray becomes less and less probable because the x-ray may be absorbed by the windows which are part of the instrument and detector or the air in the path between the sample and detector. In SiPIN based portable XRF analyzers, the lowest element which is detected with acceptable detection limits is normally considered to be Ti (AN=22). The detection limits for 60 second measurements on typical SiPIN XRF analyzer are given in Table I. Thus, portable analyzers have not been useful for measurement of aluminum and titanium alloys as major components of these alloys are Mg (AN=12), Al (AN=13) and Si (AN=14).

Jan 1, 2009

By Takeo Fujino, Nobuaki Sato, Junichi Hasegawa, Masato Nakazawa, Kohta Yamada

"Tantalum oxide thin films were deposited on quartz substrates by laser ablation of Ta2O5 target using Nd:YAG pulse laser. Deposition-was observed when a laser light energy higher than 200 mJ and its repetition rate higher than 3 Hz. A thin film of 0.1 µm thickness was obtained by the ablation using a laser light of 300 mJ and 6 Hz for 2 sec. The thickness of the film increased with increasing energy, repetition rate and irradiation time of laser. By the SEM observation, it was found that many island-like particles were deposited on quartz substrate forming a thin film. The obtained thin film, which was identified as ? Ta-O by X-ray diffraction, was oxidized to Ta2O5 by the heat treatment in air at I273 K for 3 h.IntroductionTransition metal oxides have a potential to show special characteristics in electrical, magnetic and/or optical properties. When such compounds are fabricated in the form of thin film, the special properties would be improved or new characters would appear in comparison with bulk materials. Tantalum penta-oxide is widely used as a capacitor since Ta2O5 shows high dielectric constants up to high temperatures. The tantalum solid capacitor has been fabricated by the electrical oxidation of sintered Ta metal cylinder followed by MnO2 film coating. However, further improvements, reduction and layered structure formation, are required for compacting the devices. The layered structure of thin films would be applicable for the above requirements. The formation ofTa2O5 film by low pressure CVD1), photo CVD2) and magnetron sputtering3l were reported. The laser ablation -method is one of the most convenient techniques for the deposition of thin films from their compounds, such as oxides. Formation of Ta2O5 film by pulse laser deposition (PLD) method using ArF excimer4), Nd:YAG (533nm)5) and TEA CO2 6 lasers was reported. In these PLD studies, ablation was carried out in relatively high oxygen pressures resulting in formation of Ta2O 5 film. In this paper, the deposition of tantalum oxide thin film by the laser ablation of Ta2O 5 using Nd:YAG pulse laser was examined at a viliety oxygen pressures ranging from 10-8 to 10 Torr. The morphology of the films was also investigated in relation with substrate temperature and oxygen pressure."

Jan 1, 2000

By Y. Maeda

Kosaka Smelter is a copper smelter located at the nothern part of Japan? and has been treating. complex sulfide concentrates using flash smelting technology for a long time. The flash smelting technology has an advantage in the point of controllability of matte grade and heat balance in the reaction shaft. But the disadvantage of this process, is that the dust generation ratio is high compared with other smelting process such as injection smelting technology. This reason why is that the flash smelting process is the oxidation process for the fine sulfide concentrates applying flash reaction in the oxygen enriched stream In addition of this disadvantage, the sulfide concentrates contains much volatile impurities is resulted the dust; eneration ratio more. This paper outlines the recent improvement of the flash reaction in the furnace and the behavior of impurities in Kosaka Smelter.

Jan 1, 1998