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By Leszek Blacha

Since several years aog there is noted an increasing importance of the metallurgical vacuum technologies. This refers mainly to the extra furnace steel treatment processes, melting of steel and special alloys in the induction and arc vacuum furnaces, as well as refining processes of nonferrous metals. In the presented work, there is discussed a phenomenon of evaporation of volatile components of metal bath under reduced pressure with description of kinetics of this process. In this article are presented are the evaluation of the mass transfer coefficients in the melt and gaseous phase. Based on results of our own research on removal rate of impurities from liquid copper (bismuth, lead) in vacuum refining process, it is determined the thickness of hypothetical boundary layer in the gas phase. This allowed to formulate a general kinetic equation defining the evaporation rate of gaseous components from metal bath. The values of mass transfer coefficients determined from this equation were compared with experimental results by other authors working on the evaporation effect of melt components of metal alloys.

Jan 1, 2006

By B. J. Beaudry

The effect of various levels of purity of the rare earth fluorides and the calcium reductant used to prepare rare earth metals were determined. Metals which have low melting points such as La, Ce, Pr and Nd are not purified by distillation or sublimation. Impurities in the reactants remain as contaminants in these metals. Gd, Tb, Y and Lu which have slightly higher vapor pressures at their melting points than the first four metals are usually distilled to remove the Ta or W impurity introduced by the crucible and are purified slightly with respect to 0 and N by distillation. Rare earth metals that have high vapor pressures such as Sc, Dy, Ho and Er can be purified with respect to 0, N, C, as well as Ta or W by sublimation. The most volatile rare earth metals Sm, Eu, Tm and Yb are readily purified by sublimation and are usually prepared by a reduction-distillation process directly from the oxide. The importance of each step of the processes in determining the final purity of the individual rare earth metals is discussed.

Jan 1, 1989

By M. I. Kalashnikova

The leaching of metal nickel in copper sulfate solutions is investigated. It is established, that irre-spective of presence or absence of chloride-ion and oxidizer (oxygen) in system process can be divided into three stages, characterizing by restoration and oxidation of metals with formation of metal copper and cuprite and differing in the speeds of sedimentation of copper and transition of nickel into solution. At the initial stage of process along with allocation of metal copper it is be-sieged cuprite, that results in excess of speed of sedimentation of copper in comparison with dis-solution of nickel. At the second stage speed of transition of nickel into solution falls practically to zero, and sedimentation of copper proceeds on reaction of interaction of metal copper with copper sulfate solutions with cuprite formation. During the final period speed of transition of nickel into solution exceeds speed of sedimentation of copper due to course of reaction of resto-ration of cuprite up to metal. Influence of an ion of chloride and oxidizer on formation of various phases is revealed. It is established, that presence of an oxidizer results in increase in a share of cuprite in a deposit. With increase of the maintenance of chloride-ion speed of metal copper allo-cation essentially grows even at presence of an oxidizer in system.

Jan 1, 2006

By Chuan-fu Zhang

In present work, the physical properties of molten FenO-MgO-CaO-SiO2 slags were measured .It is shown by the results that when the slag composition is as follow: MgO 8%~12%, CaO 2%~8%, Fe/SiO2 1.2~1.6, the viscosity of the slags decreases with the increase of temperature. When the Fe/SiO2ratio and the MgO content are fixed, the electrical conductivity increases and the viscosity decreases as CaO content increasing, while the content of CaO exceeds 6% its influence weakens. When the MgO content is 11% and the CaO is 6%, the viscosity of the slag decreases markedly as the increase of Fe/SiO2 ratio. Its influence to viscosity is inconspicuous when the Fe/SiO2 ratio exceeds 1.5. When the CaO content is 6% and Fe/SiO2 is 1.2, the electrical conductivity decreases with the increase of MgO content as temperature is below 1290, but increases when temperature is above 1290. When the MgO content is 11% and the Fe/SiO2 ratio is 1.2, the electrical conductivity increases with the increase of CaO content. When the CaO content is 6% and MgO content is 11%, the electrical conductivity increases as the increase of Fe/SiO2 ratio, while its influence weakens as the temperature increases continuously. The electrical conductivity rises when temperature increases at any slag content. The melting temperatures of FenO-MgO-CaO-SiO2 semi- synthesis slags from this work were below 1290.

Jan 1, 2006

By Katsunori Okaya, Gjergj Dodbiba, Hiroyuki Ono, Toyohisa Fujita, Seiji Matsuo

"In an attempt to raise the copper grade of Printed Circuit board (PCB) by removing other components, carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under nitrogen atmosphere. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The liberation of copper foil from the oversized pieces was also investigated. The copper foil was liberated easily from glass fiber by stamping treatment. Liberation rate of copper foil was high at high carbonized temperature. The experimental results indicated that 90% of oversized char was liberated and the copper foil recovery from PCB carbonized at 1073K was 110kg/t. The copper recovery from char powder by flotation was also investigated. 15% of the copper grade and 80 % of the copper recovery were obtained, whereas the removal rate of silicon was 55%.IntroductionWaste Electrical and Electronic Equipments (WEEEs) should be recycled because they have many kinds of valuable materials and most WEEEs include Printed Circuit Boards (PCBs). In Japan, about 30 km2 per year of Printed Circuit board (PCB) has been produced [1], PCBs are normally separated from WEEEs and picked up by hand and sold to non-ferrous metal market because PCBs include high grade of copper and other precious metal such as gold, silver and palladium [2]. However, PCB also has impurities such as silicon, aluminum and calcium which are slag materials in non-ferrous smelting process, and other harmful elements such as lead, bromine and antimony. Low grade PCBs are sold after removal of invaluable parts or sometimes land filled without any treatment"

Jan 1, 2011