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Removal Of Arsenic And Selenium From Wastewaters -A ReviewBy Abbas H. Mirza
Arsenic and selenium are found in low quantities together with other metals in several nonferrous metallurgical process streams such as scrubber blowdown solution, acid plant wastewater, gas cleaning
Jan 1, 1996
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SAES ST909 Material Phases After Methane Cracking TestsBy J. E. Klein
Bench scale tests using a stack of ten whole SAES St909 pellets, 6 grams, to crack methane have been completed with pure methane feed. Test conditions ranged from 600 to 800°C at 101 kPa (760 ton) wit
Jan 1, 2002
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The Reduction of Alumina beyond the Year 2000 Overview of Existing and New ProcessesBy A. F. Saavedra, N. E. Richards, C. J. McMinn
"The aluminum industry in general and Reynolds Metals Company in particular have continued to support development work for improvement of the Hall cell design and for alternative processes for the red
Jan 1, 1988
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The Cathode Process of Aluminum Chloride ElectrolysisBy R. Tunold, Y. J. Zhang
"The cathodic kinetics of aluminum deposition from aluminum chloridealkali chloride melts was studied by use of electro-cnemical transient techniques at 700 °C. Aluminum deposited as an insoluble prod
Jan 1, 1988
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Oxygen-Flame Converting of Nickel MattesBy V. M. Paretsky
Oxygen-flame converting of a solid ground matte containing heavy non-ferrous metals in a wide range of concentrations is one of the perspective trends meeting the demands of modern non-ferrous metallu
Jan 1, 1993
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SPL Treatment and Fluoride Recycling ProjectBy K. Mansfield
Spent Pot Lining (SPL) is an unavoidable waste product of the electrolytic process in the smelting of aluminium. SPL is considered to be a hazardous waste in various countries because it contains sign
Jan 1, 2002
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K-SOIL? An IMCO Recycling Inc. DevelopmentBy F. Robert Hubbard
IMCO Recycling Inc. has developed a new, patented technology for the production of fertilizer, K-SOIL?, as a by-product of its aluminum recycling operations. This new technology can substitute for con
Jan 1, 1995
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Recovery Of Gold From Thiosulfate Solutions And Pulps With Ion- Exchange ResinsBy Michael J. Nicol
Growing environmental and occupational safety concerns about the use of cyanide in gold processing has increased the interest in more acceptable alternatives. The most likely of these is thiosulfate.
Jan 1, 1998
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Tile Production Using Wastes from Mining Industry of the Mining District Pachuca and Real Del MonteBy A. Iván, Patiño C. Francisco, Flores B. Javier, Peréz L. Miguel, Hernandez A. Juan, Trapála P. Norma, Salinas R. Eleazar, Rivera L. Isauro, G. Flores, U. Mizraim
"Tills work is related with the production of tiles using wastes from mining and metallurgical industry of Hidalgo State, as raw material. These wastes present a majority particle size (60 %), minor t
Jan 1, 2012
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Microemulsions: Compartmentalized Fluids for Metal Separations and Materials SynthesisBy K. Osseo-Asare
"The molecular structural and solution chemical characteristics that underlie the surface activity of solvent extraction reagents are highlighted, with particular emphasis on the tendency towards reve
Jan 1, 1996
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Mathematic Models of Lost Currents in Bipolal CellsBy Zhao Guangwen, Wu Tan, Qiuzhan Tian, Duan Shuzhen
"A thorough study of lost currents in bipolar cells has been made for the development of the great potential of bipolar cells in energy saving. A proper equivalent circuit for bipolar cells has been f
Jan 1, 1988
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Microemulsions: Compartmentalized Fluids For Metal Separations And Materials Synthesis'By K. Osseo-Asare
The molecular structural and solution chemical characteristics that underlie the surface activity of solvent extraction reagents are highlighted, with particular emphasis on the tendency towards rever
Jan 1, 1996
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Room-Temperature Production of Ethylene from Carbon DioxideBy Kotaro Ogura
"Ethylene has been produced in aqueous solution from CO2 by the electrochemical reduction driven by a natural energy. This process is useful for storing a large amount of the natural energy. In the cl
Jan 1, 2009
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Fluidized Bed Applications for the Minerals Industry and Renewable EnergyBy Joerg Hammerschmidt, Marcus Runkel, Andreas Wirtz, Kent Pope
"Fluidized bed reactor systems in the minerals industry have been progressively developed and widely implemented over a period of more than sixty years for a multitude of process applications. Their v
Jan 1, 2014
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Comparative Evaluation of Sulfuric and Hydrochloric Acid Atmospheric Leaching for the Treatment of Greek Low Grade Nickel LateritesBy Christiana Mystrioti
Greece is the only EU country with extensive nickel laterite deposits. Since the 1960s, the Greek laterites are treated for ferronickel production via a pyrometallurgical route, which involves pre-red
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump MetallizationsBy Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003
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Evaluation of Non-Equilibrium Minor Components in PyrometallurgyBy Akira Yazawa
In the field of pyrometallurgy, the equilibrium evaluation has recently become easy by use of thermodynamic software, but it is strongly desired to estimate the amounts of non-equilibrium minor compon
Jan 1, 1998
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Evaluation of Physical Coal Beneficiation using Computerized MicroscopyBy W. E. Straszheim
Computerized microscopic techniques were used to determine the size and identity of the ash-forming mineral components, as well as their association with the organic coal matrix, in order to aid in th
Jan 1, 1989
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Electrochemical Aspects of Electro winning Lead Metal From Brine-Lead Chloride Electrolytes in the Temperature Range 55-80°CBy Xiangwen Wang
Electrochemical measurements associated with the electrowinning of lead metal from concentrated brine (NaCI) - lead chloride (PbCI,) electrolytes at temperatures in the range 328 to 353°K (55 - 80°C)
Jan 1, 1993
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump Metallizations (0810a053-7c7a-4a4b-be9d-246cf684a53d)By Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003