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Sintering Performance of Blends Containing High Proportion of LimoniteBy De-qing Zhu, Feng Zhang, Jian Pan
Sintering performance of a series of sinter blends with high ratio of limonite was investigated. The metallurgical performance and mineralogy of product sinter were also examined. The results show tha
Mar 1, 2017
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Process Mineralogy in Ore Deposits DevelopmentBy Norman Schapiro
Future ore bodies will, most likely, be more costly to find, mine and process than those now in production because most of them will be of lower grade or found deeper. To evaluate an ore deposit for
Jan 1, 1981
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Research on Common Biomass Pyrolysis Production of Biomass Carbon, Pyrolysis Gas, and Biomass TarBy Jianhang Hu, Li Yang, Yonggang Wei, Kongzhai Li
"In this paper, the pyrolysis of biomasses including bamboo, sawdust and walnut shell were performed in a tube furnace under temperatures between 400? and 600? to obtain biomass carbon, gas, and tar.
Jan 1, 2014
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Reduction and Separation of High Iron Content Manganese Ore and its MechanismBy Zhucheng Huang, Lingyun Yi, Bin Chai, Tao Jiang
"A high iron content manganese ore was reduced at 900~1200°C and followed by a magnetic separation process. SEM and EDS analyzes were employed to examine the transformation of microstructure and phase
Jan 1, 2013
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Preparation Of Monodisperse CdS Nanoparticles By Hydrochemical Method And Their Surface Modification (Invited)By Zhang Duomo
A novel homogenous precipitation method, including microwave heating, solution conductivity controlling and freeze drying, was developed for the preparation of US nanoparticles. The effects of the pre
Jan 1, 2003
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Refractory Challenges in Lead Recycling FurnacesBy V. Reiter, K. Reinharter, C. Wenzl, D. Gregurek, A. Spanring
The refractory linings in lead furnaces are exposed to several stresses rather complex in their interaction. In the present study the magnesia-chromite brick out of a lead recycling furnace suffered f
Mar 1, 2017
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Developments of Processing Technologies for Refractory Gold OresBy Tianzu Yang, Weifeng Liu, Lin Chen, Deyu Wang
"Due to the gradual exhaustion of easily extractive gold ores, it is vital to make efficient use of refractory gold ores which hold 30% gold storage of the world. However, the disadvantage of current
Jan 1, 2013
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Synthesis of Advanced Composite Oxides Thin Films by the Liquid Phase Deposition Method from Aqueous SolutionBy Shigehito Deki
"A new wet process has been developed for the synthesis of various kinds of oxide thin films on various kinds of substrates, even which have complex surface morphology, from aqueous solution. The proc
Jan 1, 2000
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Effect of Heat Treatment on Surface Morphology and Crystallography of Zn and Zn-Fe Electrogalvanized CoatingsBy M. M. Kim
As-electrogalvanized coatings of pure Zn, Zn-11% Fe, and Zn-18% Fe coatings were characterized in terms of initial crystal structure and surface morphology. Samples were then subjected to heat treatme
Jan 1, 1990
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Activation and Deactivation Effects of Lead on Gold CyanidationBy Rina Kim
The addition of lead to a gold leaching reactor can effectively accelerate or retard the gold cyanidation reaction. This study explored the effect of lead on the gold dissolution kinetics using cyclic
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Mechanical Activation Of Processing Of Egyptian WolframiteBy Mohamed Y. Bakr, Aly M. Abdel-Rehim
The present work is related with mechanical activation of processing of Egyptian wolframite by simultaneous ball-milling and pressure alkaline leaching, to improve the recovery of tungsten from wolfra
Jan 1, 2015
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Modeling of Lost-Wax Foundry Process.By R. Hamar, G. Lamanthe
"To realize complex shaped pieces, like turbine blades, superalloys are cast with the lost-wax process. The end properties of these parts depend upon their microstructure as well as upon the occurence
Jan 1, 1986
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Heat Losses To Furnace Coolers As A Function Of Process IntensityBy Pan Gu, Zhen Zhang, Jiang Diao, Bing Xie, Hongyi Li
Furnace refractories are in most cases chemically incompatible with smelter slag, which leads to a steady erosion in their thickness over time. Once too thin, refractory walls become mechanically unst
Jan 1, 2016
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Increasing Mass Transfer in Aqueous Solution By Use of Microporous MembranesBy F. Tailoka
Microporous membranes have been used to create a very fine dispersion of bubbles which greatly enhances the mass transfer of electroactive species to the electrode. Using this system, it has been show
Jan 1, 1990
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Room-Temperature Production of Ethylene from Carbon DioxideBy Kotaro Ogura
"Ethylene has been produced in aqueous solution from CO2 by the electrochemical reduction driven by a natural energy. This process is useful for storing a large amount of the natural energy. In the cl
Jan 1, 2009
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Dynamics of Splash Formation in Gas Injected SystemsBy N. B. Gray, A. E. Guerra, D. E. Morton
"The formation of splash in pyrometallurgical operations that involve the injection of gases into a liquid has been the subject of a number of studies over the last few decades. Given the complexity o
Jan 1, 1996
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Mathematical Correlation of Thermochemical Properties For Molten Cu-Bi, Cu-Sb, Bi-Sb and Cu-Bi-SbBy H. H. Kellogg
The thermochemical properties of molten solutions in the binaries Cu-Bi, Cu-Sb and Bi-Sb, as well as the ternary Cu-Bi-Sb, have been correlated and described in mathematical form by use of the associa
Jan 1, 1985
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Viscosity of High Magnesium Content FeO-Fe3O4-SiO2-CaO-MgO Slags at Nickel Flash Smelting ConditionsThe viscosity of high magnesium content FeO-Fe3O4-SiO2-CaO-MgO slags at nickel flash smelting conditions was investigated using a commercial rotational viscometer. The studied parameters were composit
Jan 1, 1999
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump MetallizationsBy Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003
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Reaction Of Sn-Containing Solders With Nickel Based Under Bump Metallizations (0810a053-7c7a-4a4b-be9d-246cf684a53d)By Guojun Qi
This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because
Jan 1, 2003