Experimental Modeling of Nodulation in Copper Electrorefining

Concerning nodulation in copper electrore fining, it has been reported that short circuits caused by nodulation have the largest impact on the current efficiency. Therefore, to improve the current efficiency, it is important to prevent nodulation. In this research, the nodulation growth was investigated by replicating nodulation in the laboratory. The experiments were conducted by cathodic electrodeposition on copper plates attached to copper sticks of various heights. The nodulation was analyzed in terms of growth rates versus the initial heights.